SMT STENCILS MANUFACTURE

Institute of Computer Technologies provides service of manufacture SMT stencils out of stainless steel by laser cutting.

Thickness of material for manufacture of stainless steel stencil:

0,050 mm (recommended with reinforcement of the stencil)
0,080 mm (recommended with reinforcement of the stencil)
0,100 mm (recommended with reinforcement of the stencil)
0,120 mm
0,127 mm
0,150 mm
0,200 mm
0,300 mm

Stencil edge reinforcement is carried out by means of welding on additional steel strips of 0.2 mm thickness in the area of perforation apertures.

STENCILS ON ALUMINUM FRAME

Variants of the aluminum profile section:

20х30 mm
30х40 mm
40х40 mm

Maximum frame size 736×736 mm.

Stencils on their own frame retain a constant tension of the metal in operation process for a long time. It is recommended to use stencils on frame for large-scale assembly of electronic products.

MULTI-LEVEL STENCILS

Multi-level stencil is used when it is necessary to apply to a printed circuit board solder paste with different layer thickness. This need arises when assembly of individual electronic components with special requirements for the amount of solder paste is carried out.

Multilevel stencils can be manufactured both with lowering of separate apertures and with raising. It is also possible to produce a stencil with several levels of thickness variation.