PRINTED CIRCUIT BOARDS DESIGN

MULTILAYER PCBS WITH IMPEDANCE CONTROL

BOARDS WITH BLIND AND BURIED VIAS, HDI

BACKPLANES

FLEX AND RIGID-FLEX PCBS

MICROWAVE BOARDS, ANALOG AND ANALOG-DIGITAL BOARDS

BOARDS WITH HIGH-SPEED DIGITAL AND ANALOG-TO-DIGITAL INTERFACES

WITHIN THE PCB DESIGN SERVICE, THE FOLLOWING TASKS ARE COMPLETED:

• CALCULATION AND DESIGN OF MULTILAYER PCB STACK-UP

• DEVELOPMENT OF HIGH-SPEED CIRCUITS AND DIFFERENTIAL PAIRS DESIGN

• ANALYSIS AND MODELING OF INTERFERENCE IMMUNITY

• ANALYSIS AND MODELING OF SIGNAL INTEGRITY

• MODELING AND CALCULATION OF HEAT GENERATION

During design of printed circuit boards, engineers of Institute of Computer Technologies are guided by the requirements of IPC standards. Development is carried out taking into account the requirements of manufacturability and PCB assembly (DFM and DFA principles).

REDESIGN SERVICES:

• REDESIGN OF PRINTED CIRCUIT BOARDS DOES NOT IMPLY SIGNIFICANT CHANGES IN THE CIRCUIT DESIGN SOLUTIONS OF A PROJECT AND IS NECESSARY IN THE FOLLOWING CASES:

• THE FINISHED PROJECT CONTAINS OBSOLETE, DISCONTINUED COMPONENTS THAT NEED TO BE REPLACED

• THE FINISHED PROJECT NEEDS TO BE OPTIMIZED FOR BATCH PRODUCTION: REPLACEMENT OF THT ELEMENTS FOR SMT-COMPONENTS FOR AUTOMATIC ASSEMBLY, REPLACEMENT OF HARD FOR PROCUREMENT COMPONENTS ON THEIR ANALOGS

• THE FINISHED PROJECT WAS PREPARED IN OUTDATED CAD-SYSTEMS AND IT NEEDS TO BE CONVERTED INTO MODERN APPS

• DESIGN DOCUMENTATION OF THE PROJECT IS PARTIALLY OR COMPLETELY LOST AND NEEDS TO BE RESTORED

TERMS OF PCB DESIGN AND REDESIGN:

NUMBER OF PADS UP TO 3000

1,5-2 weeks

NUMBER OF PADS FROM 3000 TO 6000

2-4 WEEKS

NUMBER OF PADS FROM 6000 TO 10000

4-6 WEEKS

CONTACTS

VICTORIA LUZAN

Head of Customer Service Department