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Sales department: Kyiv, Digtyarivska Street 53 A, office 202, tel. +38 (044) 451-58-80, e-mail: kiev@ictech.com.ua

Engineering department:  Chernihiv, Industrialna Street 2, tel.: +38 (044) 331-03-75, fax: +38 (0462) 608-620, e-mail: info@ictech.com.ua

Institute of Computer Technologies

Design and manufacture of high complexity multilayer PCBs

Outsourcing electronics development and PCB design services

RU

Product range

Multilayer PCBs

The broad range of dielectrics with various parameters are used to manufacture ML PCBs. Using the most advanced materials (enhanced FR4, FR4 High Tg) allows to produce boards with larger layers quantity and complex route patterns.

Examples of multilayer PCBs :

The PCB of the module for digital signal processing

Mobile navigation system GPS / GLONASS

Multilayer PCB used in:

  •  complex multimedia devices;
  • computing and automation devices;
  • complex measuring equipment;
  • digital signal processing;
  • cross-connecting PCBs and backplanes;
  • telecomunications;
  • board (aviation, space, etc.) management system;
  • Automation and automated control devices;

Please, contact Institute of Computer Technologies for a free consultation on manufacturing of Multilayer PCBs:

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Microvave PCBs

Institute of Computer Technologies manufactures printed circuit boards of high-frequency materials for devices of HF and Microwave frequency ranges.

Examples of microvave PCBs:

Please contact ICTech for a free consultation on manufacturing of Microwave PCBs:

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Flex PCBs

Flexible printed circuits (up to 8 layers) and flat flexible cables have significantly advantages over traditional wired cables in complex devices, reducing assembling cost and allowing to connect different connectors and components in different locations in 3D designs. The core materials are low thickness polyimide films and PET (Polyethylene terephthalate).

Example of flex PCB :

Technical parameters:

Functional reliability class according IPC-A-600G:                                             III

Type of substrate material, manufacturer brand:  Polyimide, FELIOS®FLEX

Layers number:                                                                                                               2

Board thickness:                                                                                   0,22 mm ±10%

Board dimensions:                                                      1034,00 х 20,60 ± 0,50  mm

Thikness of the foil:                                                                              RA ELS, 35 µм

Holes number:                                                                                                       13089

Minimal diameter of the through hole:                                                    0,20 mm

Minimum circuits width:                                                                             0,150 mm

Minimal gap between lines:                                                                       0,150 mm

Finish type:                                                                              ENIG - immersion gold

Gold thickness:                                                                                                0,021 µм

Type of the solder mask:                        Polyimide coverlay R-F705, Panasonic

Please contact ICTech engineering department for advice on the design and manufacture of Flex PCBs:

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Rigid-flex PCBs

All the advantages of rigid and flex PCBs are combined into rigid-flex PCBs. They allow to avoid using expensive high-speed "large" connectors and to reduce overall weight and size of device.

Examples of the rigid-flex PCBs

Please contact ICTech engineering department for advice on the design and manufacture of Rigid-flex PCBs:

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Metal Core PCBs

Institute of Computer Technologies manufactures Metal core PCBs for use in harsh operating conditions.

Example of Metal Core PCBs:

Please contact ICTech for a free consultation on the manufacturing of Metal Core PCBs:

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HDI Multilayer PCBs

Institute of Computer Technologies manufactures printed circuit boards of high complexity - HDI.

The features of printed circuit boards, manufactured by HDI technology:

  •  Application of chips in miniature packages μBGA, QFN, CSP etc. in the device design, which are characterized by a small pin pitch and the small size of the bond sites
  • High-density pattern topology which is achieved by small width of conductors and gaps between elements of less than 0.10 mm
  • Vias of a small diameter made by technology of fine-line mechanical drilling
  • Vias of ultra-small diameter, made by laser drilling technology - micro via
  • Location of micro via directly in the sites of components - technology via in pad
  • The use of sophisticated and high-tech stacks in the design of printed circuit boards
  • The use of blind and hidden vias

The main area of application of HDI boards:

  • Mobile telephony and communications
  • Bluetooth equipment
  • Portable Navigation Systems
  • Digital cameras and camcorders
  • Wearable medical devices
  • Multimedia Devices

Examples of HDI PCBs:

Please, contact ICTech for a free consultation on the manufacture of HDI Multilayer PCBs:

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Backplane PCBs

Backplanes are big size multilayer PCBs with more than 20 layers and with large thickness. Backplanes’ structure has thick copper foil, power bus, high speed and impedance controlled layers. Backplanes can have holes for press-fit connectors and special technology of back drilling holes.

Example of backplane:

Technical parameters:

Functional reliability class according IPC-A-600G:                                             III

Type of substrate material, manufacturer brand:        FR-4 High Tg, IT-180A

Layers number:                                                                                   14, HDI, 2+10+2

Board thickness:                                                                                  1,8 0 мм ±10%

Board dimensions:                                                          52,50 x 113,60 ±0,15 mm

Finished Cu thickness on the outer layers:                                                    38 µм

Finished Cu thickness on the inner layers:                                                     18 µм

Holes number:                                                                                                       13089

Minimal diameter of the through hole:                                                    0,20 mm

Minimal diameter of the blind hole:                                                          0,10 mm

Minimal diameter of the hidden hole:                                                       0,20 mm

Minimal Cu thickness on the hole wall:                                                          26 µм

Minimal Cu thickness on the blind hole wall:                                               21 µм

Minimum circuits width:                                                                             0,075 mm

Minimal gap between lines:                                                                       0,090 mm

Finish type:                                                                              ENIG - immersion gold

Gold thickness:                                                                                                0,021 µм

Nickel thickness in the underlayer:                                                              4,08 µм

Type of the solder mask:                                                    LPI LP-4G/G-05A green

Please contact ICTech for a free consultation on the manufacture of Backplane PCBs:

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Impedance Controlled PCBs

Institute of Computer Technologies manufactures printed circuit boards with control of the wave resistance.

Control of wave resistance is required on printed circuit boards, where the pin-to-pin propagation delay and resistance matching are important:

  • Printed circuit boards with high-speed interfaces
  • Printed circuit boards for instrumentation
  • Printed circuit boards for the transceiver equipment
  • Microwave printed circuit boards

Calculation of signaling links’ characteristics requires compliance with the geometric parameters and high dimensional accuracy of the print pattern elements in the manufacture of circuit boards. Such approach will prevent the mismatch of signaling links, provide the requested features and the absence of failures in functioning of high-performance systems.

To reduce the error of reproduction of the wave resistance of the lines all the processes of printed circuit boards’ manufacture are subjected to additional controls. For the production of PCBs only certified materials with controlled tolerances and small deviations of parameters are used. During the extrusion of billets of PCBs the requirements for loading of presses and control the parameters of pressing become stricter. These measures can reduce the error of wave resistance of transmission lines in the manufacture of PCBs to the values of 8 - 10%. With a special selection of materials for the manufacture of test samples and single-piece lots of printed circuit boards it is possible to achieve higher compliance of values of the obtained wave resistance to calculated data.

Engineers of Institute of Computer Technology are ready to give advice on the correctness of the calculation and design of transmission lines on the preparatory stage of the project.

Contact ICTech specialists for advice on the use of specific technology solutions for your projects:

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PCBs with Embedded Components

Printed circuit boards with embedded components are the most complex to manufacture.

Special technologies allow to include the lead free chip components, uncased transistors, diodes, etc. inside multilayer PCBs. It is also possible to create the structure of the resistive layers  that allows to form thin film resistors. The usage of embedded components can reduce the size and weight of the device, as well as increas reliability.

Contact ICTech for a free consultation on the PCBs with Embedded Components:

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Planar Transformers

Usage of planar transformers minimizes size of devices  and improves design reliability.

For manufacturing of planar transformers the dielectrics with high breakdown voltage and thick foil are used to maintain high currents and interlayer insulations.

Example of planar transformers

Please contact ICTech for a free consultation on the manufacturing of  Planar Transformers:

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Low Cost PCBs

Class I and Class II PCBs are considered to be the mass products and are manufactured by using low-cost materials (CEM, FR3, sometimes FR4).

That is one or two layers PCBs produced with low-cost technologies.

The main area of application:

  • appliances;
  • communication devices;
  • power supplies;
  • measuring devices;
  • control systems;
  • automation and automated control devices;
  • high-current switching devices

Please contact ICTech for a free consultation on the manufacturing of Low Cost PCBs:

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Membrane Keyboards

The design of membrane keyboards has no mechanical moving parts. They are characterized by a simple manufacturing process, low cost, compactness, bending capability and working on uneven surfaces, protected from moisture, dust and other contaminants.

Please contact ICTech for a free consultation on the manufacturing of Membrane Keyboards:

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